Kyocera Corporation (TOKYO:6971), based in Kyoto, has once again delayed the start of operations at its newly constructed factory in Satsumasendai, Ka...Read More
Mitsubishi Materials Corporation and Panasonic Corporation announced on January 17, 2025, the successful establishment and operation of a PMP (Product...Read More
An automotive flexible circuit board manufacturer, Ichia Technologies Inc. (2402.TW) has announced its robust financial results for Q4 2024, marking t...Read More
On January 14, Merlin Circuit Technology, a subsidiary of the leading PCB manufacturer Merlin PCB Group, proudly announced that it has been awarded th...Read More
On December 16, 2024, the Printed Circuit Board Association of America (PCBAA) shared a significant update, revealing that its leadership, alongside I...Read More
On January 15, 2025, Japan's Nippon Electric Glass Co., Ltd. (NEG) unveiled a new glass-ceramic core substrate, the "GC Core," designed ...Read More
As demand for AI semiconductors rises, the development of glass substrates—capable of significantly improving performance—is gaining momentum. At the ...Read More
LG Innotek Takes a Major Step in Semiconductor Substrate ProductionLG Innotek has officially begun mass production of flip-chip ball grid array (FC-BG...Read More
On January 6, 2025, Business Facilities announced the winners of its 2024 Deal of the Year Awards, honoring corporate relocation and expansion project...Read More
PCB supplier Fineline Nordic / Cadint Sweden have announced the appointment of Göran Karlström as their new General Manager, effective January 6,...Read More
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