A specialist in chemical solutions for printed circuit boards and copper plating, YMT(KOSDAQ:251370), announced on the 13th that it has successfully supplied the first sample of 'TGV (Through Glass Via) Full Fill Copper Plating' for semiconductor glass substrates.

Traditionally, circuit boards have been made from materials like plastic and silicon. However, recent efforts to improve data transmission speeds and reduce power consumption have led to a surge in research on replacing these materials with glass.YMT has successfully developed the technology to commercialize semiconductor glass substrates. The company has created a copper plating process that enables electricity to flow from top to bottom through the insulating circuit board, making it applicable for glass substrates used in semiconductors.

Recently, YMT supplied the first sample of a copper-plated glass substrate to a package substrate client, proving that copper plating on glass circuit board materials is feasible. The company reported positive feedback from the client and is currently upgrading some of its plating equipment to meet additional orders.

A YMT representative stated, "We have secured the technology for copper plating on large-area glass substrates with high-density vias, a process known to be challenging in the glass substrate industry. With the rise of AI and big data, the demand for high-performance computing semiconductor package substrates is increasing, and we are committed to continuous R&D."

He added, "We plan to enhance our copper plating technology to fully accommodate TGV Full Fill copper plating for glass substrates, thereby boosting profitability."