A leading South Korean developer of chemical solutions for printed circuit boards and copper plating processes, YMT (KOSDAQ:251370), is reportedly in discussions with Samsung Electro-Mechanics to collaborate on mass production of semiconductor glass substrates. This follows YMT's successful delivery of its first samples featuring Through Glass Via (TGV) Full Fill copper plating technology.

According to industry sources on March 12, Samsung Electro-Mechanics is preparing to launch a pilot production line for glass substrates at its Sejong facility, with final equipment checks scheduled this month — marking the final stage before operations begin.

Glass substrates are emerging as a next-generation solution for high-performance semiconductor packaging, offering smooth surfaces and superior processability for ultra-fine line patterns. These characteristics make them essential for advanced AI chips and other high-performance processors.

However, commercializing glass substrates remains a global challenge. Industry giants like Intel, AMD, Samsung, SK Hynix, and Applied Materials are all racing to develop viable solutions.

Samsung Electro-Mechanics has taken an aggressive, first-mover approach, becoming the first in the industry to build a pilot production line domestically — a key step toward mass production.

The company is now focused on tackling remaining technical hurdles, with a particular emphasis on improving reliability — a critical factor for semiconductor glass substrates.

Last month, Samsung held a technology collaboration meeting with key industry players, including Corning, K4 Korea, YMT, HwaMyung, AKC, Innometry, Extol, and Jungwoo M-Tech. These companies specialize in glass processing, circuit surface treatment, and substrate inspection — essential technologies for scaling up glass substrate production.

YMT has been at the forefront of this innovation, having delivered its first TGV Full Fill copper plating samples to customers last year. The company's breakthrough enables conductive copper plating through insulating glass substrates, supporting the flow of electricity from top to bottom — a critical development for semiconductor glass substrates.

YMT also confirmed that it's currently modifying its plating equipment to handle increased orders from customers, signaling strong demand and accelerating its path to commercialization.