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X-ray equipment maker Xavis, is expanding into the semiconductor market following its success in the battery sector, with a particular focus on the glass substrate market. The company is currently in discussions with Samsung to supply its glass substrate inspection equipment.

Xavis

This equipment is designed to inspect the formation of copper circuits after the through glass via (TGV) process.

Xavis is still in the development phase and is actively seeking feedback from Samsung, according to sources.

Glass substrate are expected to be the next-generation material for the core layer of flip-chip ball grid array (FC-BGA) packages.

Compared to the glass fiber-reinforced epoxy resin currently in use, glass is less prone to warpage from heat, allowing for finer circuit formation and the accommodation of larger dies for AI chips.

Xavis reported 23.4 billion won in revenue for the first half of the year, marking a 155% increase year-on-year.

Editor：Lulu

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