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Unimicron announces merger with subsidiary Subtron to streamline operations and optimize structure

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To streamline operations and optimize its organizational structure, Unimicron (3037.TW), Taiwan's leading PCB manufacturer, announced on August 28, 2024, that its board has approved a merger with its wholly-owned subsidiary, Subtron, which specializes in IC substrates. Unimicron will be the surviving entity, with the merger effective January 1, 2025.

As part of the merger, the 255,000 shares of Unimicron held by Subtron will be canceled on the effective date, reducing capital by NTD 255,000.

About Subtron

Subtron Technology was founded in 1998 with a capital is about NT$ 2.9 billion. The company is located in the Hsinchu Industrial Zone. It joined Unimicron Group in 2000 and mereged Xinfu Electronics and Jingqiang Electronics in 2004 and 2007. The main product of the rigid board factory is the IC carrier board, which includes RF SiP (System in Package), LED Lighting, OCM (Optical Communication Module), Sensor, 5G related and PBGA/ CSP/ TFBGA, etc. While the flexible board factory produces TAB and COF, INK, EMV, TAB etc. The company has obtained international recognition with the certification of ISO-9001, IATF16949, ISO-14001 and OHSAS18001.

Editor:Lulu

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