On Oct.1, the U.S. Department of Defense (DoD) has awarded $30 million (approximately CNY 211 million) to leading global manufacturer of technology solutions  TTM Technologies Inc. to expand its advanced printed circuit board (PCB) manufacturing capabilities. The funding, facilitated through the Defense Production Act Purchases (DPAP) office, will support the acquisition of advanced manufacturing equipment and the development of prototype PCB designs. The project will begin at TTM’s Centers of Excellence across the U.S. and culminate at a new 200,000+ square-foot facility in Syracuse, New York.

"This investment is essential for ensuring that the DoD has the state-of-the-art PCB manufacturing capability required to support vital defense programs," said Dr. Laura Taylor-Kale, Assistant Secretary of Defense for Industrial Base Policy.

Senator Chuck Schumer, a key advocate for the funding, emphasized the national security benefits of domestic production. "This $30 million federal investment will ensure the future of this critical industry is secured in Central New York, creating 400 new, good-paying jobs and bolstering U.S. supply chain security," Schumer said.

The new Syracuse facility will significantly increase domestic production of ultra-high-density PCBs, supporting both national defense needs and supply chain resilience in line with the 2024 National Defense Industrial Strategy. This is the 70th DPAP award of Fiscal Year 2024, contributing to a total of $672 million across various sectors.