On September 30, Patent Result Co., Ltd. released the global rankings of companies based on their "Global Patent Scores" for epoxy resin technology related to printed circuit boards (PCBs). The rankings were compiled using the patent analysis tool "Biz Cruncher."

Epoxy resins for PCBs are a type of adhesive and insulating material known for their excellent heat resistance and insulation properties, crucial for protecting electronic circuits. Recent advancements in this technology have led to the development of high-performance epoxy resins used in 5G and electric vehicles, as well as eco-friendly alternatives aimed at reducing environmental impact.

The analysis looked at patents from Japan, the U.S., Europe, and China, combining individual patent scores to evaluate the quality and quantity of global patents in the field.

The top five companies in the global rankings are:

1. Ajinomoto

2. Mitsubishi Gas Chemical

3. Resonac

4. DIC

5. SHENGYI TECHNOLOGY

Ajinomoto leads the rankings, with significant contributions from its patents in China, where it also ranks first. Noteworthy patents include those for thermosetting resin compositions with low modulus and high magnetic properties, and for thermosetting epoxy resin compositions for multilayer PCBs with excellent adhesion and dielectric properties.

Mitsubishi Gas Chemical, ranked second, has strong patent contributions from Japan and China, as well as a higher proportion of patents in Europe and the U.S. compared to other top competitors. Its key patents include those for NHAC-based resin compositions for printed circuit boards with low water absorption and high adhesion, and resin compositions capable of forming conductor layers with superior adhesion, heat resistance, and chemical resistance.

Resonac, in third place, also sees strong contributions from Chinese patents. Its notable patents include resin compositions for PCBs with excellent high-frequency and thermal properties and polyphenylene ether derivatives for multilayer PCBs with outstanding thermosetting and high-frequency characteristics.

Ranked 4th, DIC holds notable patents such as those for active ester compounds used in cured materials with low dielectric loss angles and superior heat resistance. Ranked 5th, SHENGYI TECHNOLOGY has key patents for halogen-free resin compositions for PCBs, characterized by high glass transition temperatures, low dielectric constants, low dissipation factors, low water absorption, excellent thermal resistance, and superior flame retardancy.