Tong Hsing Electronics Phils. Inc. is one of the leading IC Hybrid assembly houses specializing on Chip Scale Package (CSP) – Land Grid Array (LGA) or Ball Grid Array (BGA) packages and other devices such as PCB assembly with Surface Mount Technology (SMT) and Chip on Board (COB) processes, Multi Chip Modules especially on RF Modules, Image Products and Ceramic Assembly manufacturing using Thick Film and DPC process.