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Tomocube Develops Core Equipment for Glass Substrates, Explores Partnerships with Five Companies

SouthKorean company Tomocube (KOSDAQ: 475960) announced on the 11th that it is developing cutting-edge equipment for glass substrates, often referred to as the "material of the future", and is in discussions with five domestic and international companies for strategic partnerships.

Advancing Holographic Tomography Technology for Glass Substrates

Tomocube is collaborating with multiple global firms to develop its Holotomography Inspection System (HT-T1) for glass substrates. The company plans to initiate customer evaluations this year, with mass production targeted for 2026.

HT-T1 is designed to inspect and measure Through-Glass Vias (TGVs) in 3D without causing damage. TGVs are microscopic electrode pathways that enable electrical flow within semiconductor packaging glass substrates, making this a critical technology for next-generation electronics.

Versatile Applications in High-Tech Industries

The HT-T1 system offers multiple functions, including measuring TGV inner wall roughness, detecting microcracks, and identifying missing laser processing areas. Beyond semiconductor applications, the technology is also applicable to glass display substrates, extended reality (XR), augmented reality (AR) glasses, and ultra-thin glass technologies.

Strategic Partnerships and Market Expansion

Tomocube is currently negotiating partnerships with three domestic firms, including L Company, for its glass substrate business. Additionally, the company is in talks with two international firms, including K Company. In the AR glass sector, discussions are also underway with domestic firm L Company and global firm M Company.

Shenzhen East Space Light Technology Co., Ltd

Tomocube's Entry into the Glass Substrate Inspection Market

By leveraging holographic tomography technology, Tomocube aims to establish a strong presence in the glass substrate inspection market, positioning it as a key growth driver for the company.

A company spokesperson stated, "By conducting high-resolution, non-destructive 3D inspections and measurements after TGV formation, we can ensure high-quality glass substrates while reducing defect rates. Additionally, pre- and post-TGV inspections will further enhance glass substrate quality and reliability."

With technological advancements and strategic collaborations, Tomocube is set to play a crucial role in the future of semiconductor and display glass substrate production.

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