A publicly listed PCB manufacturer in South Korea, TLB (KOSDAQ:356860), has successfully developed a game-changing skip via technology for high-end printed circuit boards (PCBs), achieving a milestone that no other company has yet implemented.

According to TLB on March 26, the company has completed testing and development of 1-5 layer skip via technology, an advancement beyond conventional 1-2 layer micro via and 1-3 layer skip via solutions. This innovation marks a significant leap in PCB stacking technology, addressing growing industry demands.

TLB explained that as multi-layer stacking becomes increasingly important, the company has been focused on developing cutting-edge solutions to meet customer needs.

Additionally, TLB is advancing DDR5 technology, leveraging expertise in high-layer count PCBs, ultra-fine via formation, and thin-core copper-clad laminate (CCL) technology. The company has also secured manufacturing capabilities for build-up type PCBs, strengthening its competitive edge.

This development aligns with the technical roadmaps of leading memory semiconductor companies. As component manufacturers emphasize high-end technologies, continuous R&D efforts are crucial to securing a competitive advantage.

TLB plans to lead the market by launching DDR5 PCBs and EDSFF SSDs while expanding its business scope through semiconductor test equipment PCBs.

In the early stages of its SSD business, TLB supplied high-end SSD PCBs to Samsung Electronics, with end-user applications in Apple's MacBook Air. As SSD adoption continues to rise, TLB now supplies SSD PCBs to major players, including Samsung Electronics, SK Hynix, and Micron.

Worth noting, on February 18, TLB released its 2024 earnings forecast. The company expects revenue to reach KRW 180 billion (approx. CNY 910 million or USD 120 million), a 5.1% increase from KRW 171.3 billion in the previous year. Operating profit is projected at KRW 3.36 billion (approx. CNY 17 million or USD 2.3 million), up 10.3%, while net profit is expected to surge 49.3% to KRW 3.75 billion. TLB attributed the growth to higher value-added products and favorable exchange rates.

With its breakthrough in skip via technology, strong foothold in high-end PCB manufacturing, and expanding presence in the semiconductor industry, TLB is well-positioned for future growth. The company's continued investment in R&D, coupled with its financial stability and strategic partnerships with major industry players, reinforces its competitive edge. As demand for advanced PCBs rises, TLB's innovations and market leadership will play a crucial role in shaping the next generation of electronic components.