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Taiyo America partners with LiloTree to revolutionize gold plating in PCB industry

Taiyo America has announced a new partnership with LiloTree. This partnership is part of the ongoing strategy to provide innovative technology to the PCB industry. LiloTree has developed an innovative nickel-free and Cyanide-free gold plating process that offers many advantages to the standard ENIG process.

The benefits of LiloTree’s technology are:

①No corrosion on pads / no black pads

②Long term reliability of gold-plated surface

③Able to plate tight HDI features

④Sustainability with cyanide-free

“With our strong solder mask presence in the marketplace, we will introduce the LiloTree technology to all the PCB manufacturers in North America and Europe. LiloTree’s technology fits in line with Taiyo’s continued support to the industry in providing the most innovative products for the manufacturing of PCBs,” says Zach Maekawa, President at Taiyo America. 

“LiloTree is extremely happy about this new partnership," says Kunal Shah, President of LiloTree. “Taiyo’s has a long-standing relationship with all the PCB manufacturers in North America and Europe and we are confident that they will help us in introducing our technology to the PCB industry. We both share a common goal to bring new technology to the market.”

Taiyo America was established in 1990, in Carson City, NV as a manufacturing subsidiary of Taiyo Holdings Co., Ltd. (located in Japan). We have been exceeding the industry’s needs for solder mask products, legend inks, thermal management inks, and direct imaging products to consistently meet the ever-growing and changing demands for printed circuit boards.

LiloTree is a global supplier of surface finishes to PCB and IC manufacturing. It is an advanced materials technology company, providing next-generation technology solutions through chemistry and materials innovations. Based in Redmond, Washington, we manufacture Ni-less ENIG-Premium, ENIG-Premium and other surface finishes, eco-friendly patented plating solutions offering optimum performance and better reliability at lower cost for electronic assemblies.

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