中文
Home / PCB News

Taesung Unveils Etching Equipment Designed to Prevent Glass Substrate Breakage

On November 1, South Korean PCB automation equipment specialist Taesung introduced its latest innovation—a glass substrate etching and pre-processing machine—at its headquarters in Ansan, Gyeonggi Province. In response to high market demand and specific customer requests, the company has developed equipment capable of etching copper and titanium, as well as conducting pre-treatment processes, while minimizing the risk of cracking—an inherent challenge with glass substrates.

As high-performance computing and communications technologies advance, glass substrates have emerged as a key material due to their low thermal expansion, smooth surface, and potential to integrate more complex circuits directly. Unlike conventional PCBs, glass substrates allow direct connections to semiconductor chips without silicon interposers, leading to a thinner final product. However, their fragility has posed a production hurdle, which Taesung addressed through a non-contact drive mechanism adapted from OLED manufacturing.

The etching equipment, measuring 16 meters in length, incorporates specialized jigs designed to hold glass substrates securely, reducing contact and preventing sagging—a major cause of cracks. Additionally, the machine is equipped with sensors to monitor fractures and prevent further damage during processing. The device's closed system minimizes dust and static, enabling high-precision etching crucial for semiconductor applications.

South Korean PCB automation equipment specialist Taesung

Taesung is expanding its facilities in response to rising demand, with a second factory set to open in Cheonan by July 2025. The company aims to produce up to 14 units of the glass substrate equipment per month, priced at approximately 3 billion KRW ($2.2 million) per unit. CEO Kim Jong-Hak anticipates a surge in equipment orders as PCB glass substrate manufacturers ramp up investments for mass production by 2026.

JIEJUN electronic technology

In addition to glass substrate equipment, Taesung has also developed composite copper foil equipment for Chinese battery clients, expected to reduce costs by 30% compared to existing models. With the fast-growing interest from global clients, the company expects significant revenue growth from new business segments in the latter half of 2024.

Phone

+86 191 9627 2716
+86 181 7379 0595

Working Hours

8:30 a.m. to 5:30 p.m., Monday to Friday

Copyright © 2023 HuNan Printed Circuit Association of ChinaSite mapPrivacy PolicyPowered by Bontop

Contact Us