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Taesung Co., Ltd.(KOSDAQ: 323280) announced on August 6 that it has been selected as the executor for a national project focused on developing semiconductor glass core substrate equipment. Taesung specializes in automated printed circuit board (PCB) equipment.

"Through the R&D project overseen by the Korea Technology and Information Promotion Agency for SMEs (TIPA), we emphasized the technological capabilities, importance, and market potential of semiconductor glass core substrate equipment, leading to the signing of the research project agreement," explained a Taesung representative.

The new equipment that Taesung is developing will be used in processes such as etching, exposure, and development after the Through Glass Via (TGV) process.

Over the next three years, Taesung will receive government R&D funding to develop glass core substrate equipment. A company representative stated, "We will develop glass core substrate equipment based on our existing high-performance PCB equipment technology. We are also signing MOUs and conducting business with various companies in the glass core substrate field."

Semiconductor glass core substrates replace the core material of semiconductor substrates from resin to glass. Although the core is changed to a glass material, the series of processes filling the core with Ajinomoto Build-up Film (ABF) and insulation layers on top and bottom are expected to be similar to existing Flip-Chip Ball Grid Array (FC-BGA) processes. Companies like SKC subsidiary Absolics, Samsung Electro-Mechanics, and LG Innotek are also developing glass core substrate technology.

Editor：Lulu

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