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Sumitomo Bakelite Opens New Semiconductor Encapsulation Materials Factory in China

Japanese company Sumitomo Bakelite Co., Ltd. has completed the construction of a new factory at its Chinese subsidiary, Sumitomo Bakelite (Suzhou) Co., Ltd. A ceremony was held on September 20, 2024, to mark the completion of this facility, which represents a total investment of 6.6 billion yen (approximately USD 44 million). Sumitomo Bakelite currently holds an estimated 40% share of the global semiconductor packaging materials market.

Located in Suzhou Industrial Park, the new factory spans 60,000 square meters and will expand Sumitomo’s production capacity in China by 1.3 times. This expansion aims to meet the growing demand in key markets such as smartphones, personal computers, home appliances, power devices, automotive electronics, and advanced AI applications.

 new plant of Sumitomo Bakelite (Suzhou) Co., Ltd.

 Shenzhen eagle eye online Electronic Technology Co., Ltd.

As a state-of-the-art facility, the factory incorporates advanced automation technologies, including artificial intelligence (AI) and the Internet of Things (IoT), to monitor production processes in real time. Additionally, the facility is powered entirely by renewable energy, in compliance with China’s stringent environmental and safety regulations. Equipped with cutting-edge eco-friendly systems, the factory will boost energy efficiency and support the company’s carbon-neutral goals.

Sumitomo Bakelite operates four semiconductor packaging material production bases globally, located in Japan, Singapore, Taiwan, and China. With this new Suzhou factory, the company is reinforcing its commitment to maintaining a stable supply chain and responding swiftly to customer demands in key markets. Full-scale production at the new facility is scheduled to begin in 2025.

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