Texas Governor Greg Abbott announced recently that SpaceX has been awarded a $17.3 million (approximately 126 million RMB) grant from the Texas Semiconductor Innovation Fund to support the expansion of its Bastrop facility, focusing on PCB production and advanced semiconductor packaging. This is part of a broader $280 million  (approximately 2.04 billion RMB) investment to develop SpaceX's semiconductor R&D and packaging capabilities in the region.

The Bastrop complex, home to SpaceX's Starlink production, is set to expand by one million square feet over the next three years. The expansion will enhance SpaceX's ability to manufacture advanced printed circuit boards (PCBs) and semiconductor components, as well as establish a semiconductor failure analysis lab and panel-level packaging (PLP) technologies. Once completed, the site will become North America's largest PCB and PLP production facility, underscoring SpaceX's growing presence in high-tech manufacturing.

SpaceX President Gwynne Shotwell expressed her gratitude for the support, saying, “Texas continues to lead in high-tech innovation, and SpaceX is excited to further invest in the Bastrop facility. This grant will allow us to expand our PCB and semiconductor packaging production, driving the growth of Starlink's mission to provide global connectivity.”

Governor Abbott praised the investment, saying, “This expansion positions Texas as a leader in semiconductor manufacturing and high-tech innovation. The $280 million investment by SpaceX will make the Bastrop site the largest PCB and PLP facility in North America, further strengthening Texas's role in the global tech supply chain.”

The expansion is expected to create over 400 new jobs and enhance the state's semiconductor industry, which is becoming increasingly vital to the U.S. tech sector. With this development, SpaceX continues to build on its reputation as a key player in PCB production and advanced semiconductor packaging.