On April 18th, SK hynix announced that it has signed a memorandum of understanding with TSMC to collaborate on the development of HBM4 chips, with plans to begin mass production in 2026.

SK hynix emphasized that this collaboration between the AI memory leader and TSMC, a prominent global logic foundry, will drive innovations in HBM technology.  The partnership is expected to bring about advancements in memory performance through a three-way collaboration involving product design, foundry operations, and memory provision.

Initially, the companies will concentrate on enhancing the performance of the base die situated at the bottom of the HBM package.  By leveraging TSMC's advanced logic process for HBM4's base die, SK hynix aims to incorporate additional functionality into a limited space.  This approach allows SK hynix to offer customized HBM solutions tailored to diverse customer requirements for performance and power efficiency.

Furthermore, SK hynix and TSMC will work together to optimize the integration of SK hynix's HBM with TSMC's CoWoS® technology and collaborate on addressing customer requests related to HBM.

“We expect a strong partnership with TSMC to help accelerate our efforts for open collaboration with our customers and develop the industry’s best-performing HBM4,” said Justin Kim, President and the Head of AI Infra, at SK hynix. “With this cooperation in place, we will strengthen our market leadership as the total AI memory provider further by beefing up competitiveness in the space of the custom memory platform.”

Editor：Lulu

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