South Korean printed circuit board (PCB) manufacturer Simmtech (222800.KQ) has achieved a breakthrough in semiconductor substrate technology by successfully mass-producing a slim FC-BGA (Flip Chip-Ball Grid Array) with a core layer that is approximately 50% thinner than conventional products. This innovation is designed to meet the demand for smaller and thinner substrates in semiconductor chips.

Yoo Moon-sang, Director of Simmtech's Research Institute, stated at the "Overcoming the Limits of Semiconductors" conference on October 17 that the core thickness of the slim FC-BGA is about 0.4 mm, compared to the typical 0.8 to 1 mm in regular FC-BGA substrates. He emphasized that this new substrate is well-suited for the rising demand for smaller, high-performance computing systems.

The FC-BGA, primarily used in high-performance computing (HPC), is expected to see substantial market growth. By 2030, the global market for FC-BGA is projected to more than double compared to 2022. To stay competitive, Simmtech has begun mass-producing slim FC-BGA in facilities located in South Korea, China, Japan, and Malaysia.

Thinner substrates offer several advantages, such as improving battery capacity and extending device usage time, making them essential for emerging technologies like virtual reality (VR) and augmented reality (AR). Yoo also noted that the mechanical and electrical performance of the slim FC-BGA is comparable to traditional products, with the center core being 25% smaller, offering design benefits.

Simmtech utilized Cavity Technology to achieve the slim FC-BGA, which involves embedding components within the substrate using a laser-etched cavity. This is considered a next-generation technique for reducing substrate thickness.

The company aims to target markets such as automotive, consumer IT devices, and SSD controllers, with future applications in Compute Express Link (CXL) and network technologies.

Yoo added, "We also incorporated prepreg (insulating resin) to enhance the performance of the slim FC-BGA and will continue our R&D efforts to further optimize this product."