On March 21, Ningjin County signed a strategic partnership with Chinese advanced packaging company Simetric for the TGV Advanced Packaging Technology Development Project. With a total investment of 300 million RMB, this project will focus on the development and production of cutting-edge TGV (Through Glass Via) advanced packaging technology. The key components of the project include a sample testing base for glass substrates, a production and manufacturing center, as well as a TGV semiconductor equipment sales and talent training center.

This new facility will fill the gap in advanced packaging technology in the northwest region of Shandong and will become a critical hub for packaging technology innovation in northern China. The project marks a significant step in strengthening the semiconductor ecosystem in the region and aligns with China's broader efforts to advance its semiconductor self-sufficiency.

Founded in June 2020, Simetric is an emerging company specializing in advanced packaging technology. The company focuses on providing “Equipment + Process + Material” solutions for the global semiconductor packaging market. The company's technology is recognized for its ability to achieve extremely fine line processing down to 5 microns, a key capability in today's advanced packaging and high-density interconnects. Simetric also specializes in providing localized, controllable equipment solutions for high-end PCB packaging applications like TGV, RDL (Redistribution Layer), and ABF (Ajinomoto Build-up Film) for the semiconductor industry.

Following the completion of the Ningjin facility, the project aims to leverage Simetric's global-leading patents and integrate them into the local supply chain. This will accelerate the industrialization of semiconductor packaging technologies, ensuring that China continues to innovate and develop more independent solutions to meet the growing demand for high-performance electronics.

This partnership between Ningjin County and Simetric represents a significant milestone for the region's semiconductor strategy. It highlights Ningjin's ambition to become a major player in the advanced PCB and semiconductor manufacturing sector, which is vital for driving new economic growth and strengthening the local industrial competitiveness. The project will not only create a highly skilled workforce but also attract more investment and foster innovation in the semiconductor and PCB industries.

With China's increasing demand for advanced packaging solutions and the global market's transition to more sophisticated semiconductor designs, this project is poised to play a pivotal role in filling a crucial gap in the PCB industry. Moreover, it aligns with the national strategy of enhancing domestic semiconductor production, reducing dependency on foreign technology, and ensuring a stable, high-quality supply chain for critical electronic components.