Powertech Technology Inc. (PTI), a leading semiconductor assembly and testing firm in Taiwan, announced on November 8 that its board has approved the termination of its Global Depositary Receipts (GDR) listing on the Luxembourg Stock Exchange, a move aimed at reducing operational costs and simplifying procedures. The company’s GDRs, initially issued in January 2006, had only 22 units outstanding as of October 15, representing 44 common shares.

The decision to delist GDRs follows PTI’s recent asset restructuring. In June, PTI sold its Xi'an facility to Micron Technology for approximately NT$1.59 billion ($50.5 million) and 70% of its Suzhou facility to Shenzhen-based Jiangbolong Electronics for NT$4.02 billion ($128 million). The Xi'an sale was completed on June 28, impacting PTI’s Q3 revenue by an estimated NT$12–15 billion due to a reduction in monthly revenue from the plant, which previously generated around NT$500 million. Despite the revenue drop, PTI improved its Q3 gross margin to 21.4%, driven by optimized production and product mix adjustments.

In addition, PTI’s subsidiary, Greatek Electronics, announced the acquisition of land and buildings from PTI in Hsinchu, Taiwan, valued at approximately NT$196 million ($6.2 million), to support ongoing production activities. Established in collaboration with Japan’s Tera Probe, Greatek specializes in memory and logic wafer testing and joined the PTI Group in 2017.

For Q3, PTI posted a net income of NT$1.7 billion ($54 million), a 7% decrease quarter-over-quarter due to exchange rate losses, yet showing an 8.1% year-over-year increase. Cumulative net income for the first three quarters reached NT$5.27 billion ($168 million), marking a 30% annual growth. CEO Yung-Tsai Hsieh noted that while Q4 demand in consumer and automotive segments remains uncertain, growth in AI and data center products is expected to support single-digit revenue growth for the year.

PTI continues to invest in advanced packaging technologies, including fan-out panel-level packaging (FOPLP), CIS sensors, AI chips, and chip-on-wafer-on-substrate (CoWoS) packaging. The company reports steady progress in product development and validation for these technologies, which it sees as key to future growth.