SEA, a developer of glass substrate semiconductor packaging and solar equipment, announced on the 19th that it has signed a joint lead underwriting agreement with Korea Investment & Securities and Kiwoom Securities.

Founded in 2010, SEA specializes in manufacturing wet solar equipment and semiconductor packaging devices. Since 2019, the company has been developing glass substrate packaging equipment, a crucial component in semiconductor packaging processes, showcasing its technological expertise.

SEA is strengthening its competitive edge through its R&D center in Gumi, North Gyeongsang Province, which focuses on semiconductor glass substrate packaging and perovskite solar technology. The company also operates production facilities and subsidiaries in Chungbuk, Malaysia, and the United States. SEA aims to solidify its position in the global semiconductor packaging market by strengthening collaborations with major semiconductor companies.

Through the IPO, SEA plans to accelerate R&D investments, expand production facilities, and enter international markets. The company is targeting a listing in the coming year.

This development highlights SEA's growing influence in semiconductor packaging, which could have ripple effects on related industries, including PCB manufacturing, as advanced packaging technologies increasingly intersect with PCB design and production.