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On May 28, SCHMID Group N.V. (Nasdaq: SHMD) announces it is taking the next step towards advanced packaging for integrated circuits with glass cores. Together with partners, the SCHMID Advanced IC Packaging Lab Solution is currently the sole supplier for full TGV lab with all process steps necessary to turn a bare glass substrate into an Advanced Integrated Circuit (IC) Package.

The need for more powerful and efficient chips to unlock the future of Artificial Intelligence and next-generation devices is massive. With innovation cycles outpacing Moore’s law and chip architecture needing to go 3D with more complex features – SCHMID’s Advanced IC Packaging solution helps to unlock what is possible for the Electronics industry.

The introduction of glass cores in advanced packaging is dominating the market, pushing out traditional organic and silicon-based cores. This shift enhances the supply chain's diversity, making the semiconductor industry more resilient and flexible. Currently, AI and data center sectors are profiting significantly, with its use expected to extend to high-speed computing applications soon, for example automotive applications.

SCHMID Solution

Based on decades of experience in glass processing and substrate manufacturing, emerging from its unique world-class laboratory that spans over 3000 sqm and is situated at its headquarters in Freudenstadt, Germany, SCHMID has honed its ability to produce and metalize glass cores, in addition to the redistribution layers on both sides. Its R&D center uses standard Semi Additive process or the advanced ET (Embedded Traces) process, to add build up “fan out” layers, enabling the development of large-scale package substrates with glass cores of various thicknesses.

All the machines used are based on high volume manufacturing platforms and can be quickly expanded to mass volume production. The installed pilot line is also offered to key customers to expand their R&D capability and interlink it with SCHMID`s own R&D activities to increase speed further.

SCHMID Expertise in Glass

For years, SCHMID has been a leader in glass processing solutions for PV, anti-glare, and displays, including FOUP automation for ultra-thin glasses. Their expertise spans from precise laser and etching for various glass types to skilled electroplating for copper filling and planarization, all part of their lab offering.

SCHMID Embedded Trace (ET)

Glass cores provide planarity and thermal stability, essential for size reduction and precise layering. The SCHMID ET process facilitates planar surfaces and innovative via formations, enhancing material resilience and signal integrity. The new SCHMID glass core substrate lab also includes the machine platforms that guide the SCHMID process to realize the next generation of ABF (Ajinomoto Build Up Films) based fan out.

About SCHMID Group N.V.

The SCHMID Group N.V. (Nasdaq: SHMD) is a world-leading global solutions provider for the high-tech electronic, photovoltaics, glass, and energy systems industries, with its parent company Gebr. SCHMID GmbH is based in Freudenstadt, Germany. Founded in 1864, today it employs more than 800 staff members worldwide, and has technology centers and manufacturing sites in multiple locations including Germany and China, in addition to several sales and service locations globally. The Group focuses on developing customized equipment and process solutions for multiple industries including electronics, renewables, and energy storage. The Group’s system and process solutions for the manufacture of substrates, printed circuit boards and other electrical components ensure the highest technology levels, high yields with low production costs, maximized efficiency, quality, and sustainability in green production processes.

Editor：Lulu

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