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Sanfu New Materials to Acquire 40.08% Equity in Broad Chemical to Enter Huawei's Industrial Chain

(PCB UNION)——On September 12, Sanfu New Materials(688359. SH), a leading Chinese provider of surface engineering technology solutions, revealed its intention to acquire a 40.08% equity stake in Broad Chemical, a renowned supplier of specialized chemicals for PCBs in China, for a maximum amount of RMB 100 million. Following the completion of the acquisition, Sanfu New Materials will hold a controlling 51% stake in the company.

Through this equity transfer, Sanfu New Materials aims to address the demand for crucial electronic chemical products in various essential processes of PCB copper surface treatment, including pulse plating, hole plating, high aspect ratio DC plating, and carrier board plating. This strategic move will enrich the product portfolio of the company's electronic chemical division and facilitate the expansion of its PCB electronic chemical business.

Broad Chemical's PTH BU30 product and pulse plating product have gained certification from Huawei and ZTE, renowned technology companies. Furthermore, It's vertical copper plating has achieved successful applications in Huawei's antenna board, 5G communication board, as well as high-reliability automotive PCB copper plating for BMW and MERCEDES.

There is considerable speculation that Sanfu Xinke's equity acquisition of Jiangxi Boquan is a strategic move aimed at gaining entry into Huawei's industrial chain.

About Sanfu New Materials

Sanfu New Materials (stock code: 688359SH) is a prominent provider of surface engineering technology solutions. The company primarily focuses on researching surface engineering technology and developing, producing, and selling environmentally friendly specialized chemicals and equipment for surface engineering.

Its wide range of products finds extensive applications across various industrial sectors, including PCB manufacturing, 3C product manufacturing, automotive parts, hardware, bathroom products, and new energy. With leading-edge research and development capabilities, the company excels in customizing its products to meet specific requirements. Its core technologies, such as horizontal copper plating for printed circuit boards, chemical nickel-gold plating for printed circuit boards, pulse plating for printed circuit boards, hole filling plating for printed circuit boards, cyanide-free plating technology, high corrosion-resistant chemical nickel technology, chromium-free micro-etching technology for ABS, and phosphate-free low-temperature environmentally friendly industrial cleaning technology, have achieved industry-leading standards.

About Broad Chemical

Broad Chemical is a renowned supplier of specialized chemicals for PCBs in China, primarily engaged in the research and development, production, and sales of these chemicals. The company focuses on researching and producing electronic chemicals required for PCB and carrier board copper surface electroplating processes, such as pulse copper plating, hole copper plating, carrier board hole filling copper plating, high aspect ratio DC electroplating copper, and black shadow.

The company's core technology plays an indispensable role in downstream industry chain applications. For instance, Boquan Chemical's hole filling electroplating additives offer advantages like blind co-plating, deep hole processing, and direct through-hole filling, breaking the patent barriers set by prominent foreign brands in bridging through holes. The ultra-thin hole filling electroplating additive exhibits exceptional hole filling capabilities and achieves an ultra-thin surface copper layer for large and deep holes.

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