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Samsung’s compact LPDDR5X DRAM packages measure 0.65mm high, allowing enhanced thermal control suitable for on-device AI mobile applications

The LPDDR package stacks four layers of 12nm-class DRAM die, reducing thickness and improving heat resistance while increasing density

On August 6, Samsung Electronics, a global leader in advanced memory technology, has announced the mass production of the industry's thinnest 12-nanometer (nm) class, 12GB and 16GB LPDDR5X DRAM packages, reinforcing its dominance in the low-power DRAM market.

Utilizing its vast expertise in chip packaging, Samsung has developed ultra-slim LPDDR5X DRAM packages that create more space within mobile devices, improving airflow and aiding thermal control. This is particularly crucial for high-performance applications with advanced features like on-device AI.

"Samsung's LPDDR5X DRAM sets a new benchmark for high-performance on-device AI solutions, offering superior performance and advanced thermal management in an ultra-compact package," said YongCheol Bae, Executive Vice President of Memory Product Planning at Samsung Electronics. "We are dedicated to continuous innovation through close collaboration with our customers, providing solutions that meet the evolving needs of the low-power DRAM market."

The new LPDDR5X DRAM packages feature a 4-stack structure, reducing thickness by approximately 9% and enhancing heat resistance by about 21.2% compared to the previous generation. By optimizing printed circuit board (PCB) and epoxy molding compound (EMC) techniques, the package is as thin as a fingernail at 0.65 millimeters (mm), the thinnest among existing 12GB or larger LPDDR DRAM. Samsung also employs an optimized back-lapping process to minimize package height.

Samsung plans to expand the low-power DRAM market by supplying its 0.65mm LPDDR5X DRAM to mobile processor makers and device manufacturers. As demand for high-performance, high-density mobile memory solutions in smaller package sizes grows, the company aims to develop 6-layer 24GB and 8-layer 32GB modules into the thinnest LPDDR DRAM packages for future devices.

Editor：Lulu

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