中文
Home / PCB News

Samsung Electronics Announces Plan for 2-Nanometer Vehicle Semiconductors in Germany, Signals to Mercedes-Benz and BMW

Samsung Electronics held a Foundry Forum on the 19th in Germany, where the headquarters of Mercedes-Benz and BMW are located, announcing plans for mass production of cutting-edge 2-nanometer (nm) vehicle semiconductors. This move aims to secure European automakers as customers in response to the increasing demand for advanced semiconductors for electric and autonomous vehicles. 

Samsung Foundry meets with customers and partners in the European market at annual event in Munich

At the forum, Samsung Electronics revealed plans to complete preparations for mass production of 2-nanometer power devices for electric vehicle powertrains by 2026, and expand its portfolio to include industry-first 5-nanometer embedded MRAM (Magnetoresistive Random-Access Memory) processes by 2027. MRAM is a next-generation core power device that operates stably at high temperatures and with fast speed comparable to DRAM, even when the power is turned off, preserving data. Samsung Electronics began mass production of 28-nanometer embedded MRAM products in 2019 and plans to have a 14-nanometer process by 2024.

Samsung Electronics also plans to expand its currently in-production 130-nanometer BCD (Bipolar-CMOS-DMOS) process to 90 nanometers by 2025. BCD is a power semiconductor manufacturing process that combines analog, digital signal control, and high-power management into one. To achieve this, Samsung Electronics will form a consortium with 20 partners specializing in memory and package substrates, as well as testing, to develop differentiated solutions for power devices and high-performance computing.

At a gathering of key customers, Siyoung Choi, President of the Foundry Business Division, stated, "We will develop optimized processes, from AI (Artificial Intelligence) chips for autonomous driving to power devices, to lead the era of electric and autonomous vehicles."

▼▼

Fujitsu to Sell Nagano Plant to Leading Printed Circuit Board Manufacturer, FICT

Exciting Merger: Two Major Semiconductor Distributors to Delist and Relist in Spectacular Fashion

Itelma Invests $205.23 Billion to Establish Local Production of Printed Circuit Boards, Utilizing Half of the Production Capacity

Infineon Signs Semiconductor Supply Deal with Automakers Hyundai, Kia

US Strengthens Rules on AI Chip Sales to China, Expands Restrictions to Over 40 Additional Countries

Mitsubishi Corp Considering Bid for Fujitsu's Chip Unit Shinko Electric, Entry into Semiconductor Manufacturing

TSMC's Expansion Plans Face Demonstration Against, Government to Assist in Securing High-End Chip Fab

......

Read more latest news about the PCB and semiconductor industry here

Phone

+86 191 9627 2716
+86 181 7379 0595

Working Hours

8:30 a.m. to 5:30 p.m., Monday to Friday

Copyright © 2023 HuNan Printed Circuit Association of ChinaSite mapPrivacy PolicyPowered by Bontop

Contact Us