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Samsung Electro-Mechanics (SEMCO) (009150.KS) and LG Innotek (011070.KS) are showcasing cutting-edge semiconductor substrates requiring advanced technologies at South Korea's largest substrate exhibition, the KPCA Show 2024, held from September 4 to 6 at Songdo Convensia, Incheon. Both companies revealed innovative technologies, including AI and server-use Flip Chip Ball Grid Array (FCBGA) substrates, as well as glass substrates for next-generation semiconductors. The KPCA Show, now in its 21st year, brings together over 240 domestic and international companies to share the latest technological trends.

Samsung Electro-Mechanics booth at KPCA Show 2024 (Sep 4-6)

SEMCO organized its exhibition booth into two main themes: the Advanced Package Substrate Zone and the On-Device AI Package Substrate Zone. The company is displaying next-gen large-area, high-layer, and ultra-thin semiconductor substrates, which are essential for high-performance computing in AI, cloud, and automotive electronics.

visitors are looking at Samsung Electro-Mechanics' semiconductor package substrates

Among the highlights is SEMCO's high-end AI and server-use FCBGA technology. These advanced products are six times larger and have twice the layers—more than 20—compared to standard FCBGA, enabling ultra-fast signal processing. SEMCO is also introducing Co-Package substrates that integrate system-on-chip (SoC) and memory onto a single board. Additionally, the company is debuting its innovative glass core substrates, which drastically reduce warping and signal loss in large-area substrates.

Kim Eung-soo, Executive Vice President and Head of the Package Solution Business Division at SEMCO, stated, "We aim to secure the key technologies required for next-gen substrates and focus on high-end markets such as servers, AI, and autonomous driving."

LG Innotek booth at KPCA Show 2024 (Sep 4-6)

LG Innotek is also presenting FCBGA substrates, alongside package and tape substrates, demonstrating their innovative substrate technologies. LG’s FCBGA boasts high circuit density through fine patterning and ultra-small via processing, and visitors can observe the multi-layer and high-density structure in 3D models. The company is also highlighting its multilayer core (MLC) substrate technology, essential for large-area FCBGA manufacturing.

LG Innotek FC-BGA substrate

In addition, LG Innotek is introducing glass substrate technology for high-spec semiconductor applications for the first time at KPCA Show 2024, showcasing advancements in signal transmission for high-performance chips by reducing high-frequency noise.

In the Mobile Zone, semiconductor substrates used in the latest mobile wireless communication frontend modules, application processors, and memory will be showcased.  Various products, including the world's No.1 market share wireless frequency system-in-package (RF-SiP) and Flip Chip Chip Scale Package (FC-CSP), will be on display. In the Display Zone, key products such as Chip on Film (COF), which continues to hold the global No.1 market share, 2-Metal COF, and Chip on Board (COB) will be highlighted.

Kang Min-seok, Senior Vice President and Head of the Substrate & Materials Business Division at LG Innotek, emphasized, "We will continue to provide high-value-added substrate products that offer differentiated customer value, solidifying our leadership position in the industry." LG Innotek also set up a recruitment corner within its exhibition booth to attract top talent in the substrate field.

Overall, the KPCA Show 2024 provided a key platform for both Samsung Electro-Mechanics and LG Innotek to demonstrate their leadership in advanced semiconductor substrate technology. Their cutting-edge innovations, particularly in AI and next-gen semiconductors, underscore their commitment to addressing the evolving demands of the high-performance computing and electronics markets. As competition in the semiconductor industry intensifies, these breakthroughs will play a crucial role in shaping the future of AI, cloud computing, and autonomous driving technologies.

Editor：Lulu

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