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On June 6, Rogers Corporation announced plans to drive further operational efficiency and margin improvement. Rogers intends to wind down manufacturing of advanced circuit materials and other related activities at its Evergem, Belgium factory by mid-2025. Rogers will continue to support its advanced circuit materials customers through its existing footprint in China and the United States.

These actions are expected to improve operating profit by between $7 to $9 million (approximately 51 to 65 million RMB) annually once fully implemented. To achieve these savings, the Company expects to incur total charges in the range of $18 to $28 million (approximately 130 to 203 million RMB), comprising employee severance and related shutdown expenses.

“Providing high levels of support to our customers, in the regions they operate, is at the core of our global operations footprint strategy,” said Colin Gouveia, Rogers' President and CEO. “As customer demand for our high frequency circuit materials continues to shift to other regions, we are adjusting our manufacturing operations in response. These intended actions will improve customer service levels, drive higher factory utilization rates, lower future costs, and increase margins. We are committed to treating all affected employees fairly and respectfully.”

About Rogers Corporation

Rogers Corporation (NYSE:ROG) is a global leader in engineered materials to power, protect and connect our world. Rogers delivers innovative solutions to help our customers solve their toughest material challenges. Rogers’ advanced electronic and elastomeric materials are used in applications for EV/HEV, automotive safety and radar systems, mobile devices, renewable energy, wireless infrastructure, energy-efficient motor drives, industrial equipment and more. Headquartered in Chandler, Arizona, Rogers operates manufacturing facilities in the United States, Asia and Europe, with sales offices worldwide.

Rogers’ Advanced Electronics Solutions (AES) business delivers advanced material solutions to solve design issues such as signal integrity, Radio Frequency (RF) signal management, power efficiency, power distribution and thermal management, to deliver improved device and system reliability. These solutions include high frequency laminates, bondplys, prepregs, cooling solutions, ceramic substrates and busbars.

Editor：Lulu

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