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Ram Technology, a South Korean semiconductor materials company, is entering the Through-Glass Vias (TGV) etching solution market for glass substrates. As part of its strategic business expansion, the company is supplying TGV etching solution samples to a domestic glass substrate manufacturer Samsung Electro-Mechanics.

Industry sources disclosed on the 1st that Ram Technology is currently providing hydrofluoric acid-based TGV etching solution samples to Samsung Electro-Mechanics with the basic specification development phase already completed.

The TGV etching process is essential for the mass production of glass substrates. TGVs are holes that facilitate electrical signal transmission and are subsequently filled with copper. They are comparable to Through-Silicon Vias (TSVs) used in semiconductors such as High Bandwidth Memory (HBM), with TGVs serving to connect the chips mounted on glass substrates to the underlying substrate.

An industry insider commented, “Ram Technology has completed the development and basic specification evaluation of its TGV etching solution with customers. The company is collaborating with customers to customize the etching solution specifications according to their requirements.” The insider further noted, “Mass production of the TGV etching solution is expected to occur at Ram Technology's Geumsan plant.”

The mass production of Ram Technology's TGV etching solution is anticipated to commence post-2026, as Samsung Electro-Mechanics aims to start the mass production of glass substrates by then. However, some analysts suggest there may be potential delays in mass production due to the absence of detailed usage roadmaps for glass substrates from major customers such as Intel, NVIDIA, and AMD.

On June 27, Ram Technology announced a "Revised Public Disclosure of New Facility Investment," indicating its consideration of investments in products that are currently under patent application. These include TGV chemicals, phosphoric Quantum purification technology chemicals, chemicals for removing metallic impurities, HBM chemicals, and semiconductor packaging chemicals. Since 2020, Ram Technology has been planning to establish a hydrofluoric acid plant in Dangjin, Chungnam. However, the investment plan is under review following the company's loss in a final administrative lawsuit against Dangjin City.

Editor：Lulu

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