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On September 4, Taiwanese foundry Powerchip Semiconductor Manufacturing Corp. (PSMC) (6770.TW) announced that AMD and several U.S. and Japanese companies will utilize its Logic-DRAM multi-layer wafer stacking technology, combined with advanced logic processes from leading foundries, to develop high-bandwidth, high-capacity, and low-power 3D AI chips. These chips aim to provide cost-effective, high-performance solutions for large-scale language model AI applications and AI PCs.

To meet the increasing demand for GPUs and HBM in AI, PSMC's high-density capacitor IPD-enabled 2.5D interposer has also received certification from major global companies. Mass production of these interposers will begin at PSMC's new plant in Tongluo.

Previously, PSMC, in collaboration with the Industrial Technology Research Institute (ITRI), developed the world’s first 3D AI chip specifically designed for generative AI applications, which recently won the 2024 World R&D 100 AI Chip Award. At SEMICON Taiwan 2024, PSMC unveiled its 3D wafer stacking Logic-DRAM technology. This innovative process, used in 3D AI chip production, delivers data transmission bandwidth 10 times higher and power consumption one-seventh that of traditional AI chips, making it ideal for AI inference systems.

PSMC's 3D wafer stacking Logic-DRAM technology has garnered significant industry attention, and the company has partnered with AMD, Japanese GPU designers, and other global system integrators to develop new 3D AI chips. These chips leverage the advantages of 3D wafer stacking, combining PSMC's multi-layer technology with cutting-edge logic processes from top-tier foundries.

PSMC also emphasized that, depending on the specific design needs of its customers, the company works with partner AP Memory to design custom DRAM chips. By integrating these with its Logic-DRAM multi-layer wafer stacking technology, the resulting 3D AI chips offer 100 times the bandwidth and vastly increased memory capacity compared to current 2.5D AI chips that rely on HBM.

Additionally, to support GPU, HBM2E, and HBM3 demands, PSMC has developed 2.5D interposers with high-density capacitor IPD technology, which have been certified by international customers. The company is now rapidly building production lines at its Tongluo facility to accelerate mass production in response to growing customer demand.

Editor：Lulu

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