On March 13, 2025, Philoptics (KOSDAQ: 161580), a South Korean manufacturer of high-tech and PCB equipment, has taken another significant step in the commercialization of glass substrates, announcing the shipment of its first laser singulation equipment to a global semiconductor manufacturer. This follows the company's groundbreaking success last year, when it became the first in the world to supply Through-Glass Via (TGV) processing equipment for mass production lines — marking a rapid expansion of its glass substrate equipment lineup.

Pioneering Glass Substrate Solutions

Glass substrates are emerging as a next-generation alternative to traditional silicon-based interposers and organic semiconductor substrates, particularly in high-performance computing applications like GPUs and HBM chips. Compared to silicon, glass offers superior thermal stability, reducing warpage during high-heat processes — a key advantage for AI semiconductor manufacturing. Industry analysts predict glass substrates could cut power consumption by 30% and boost data processing speeds by 40% if successfully commercialized.

However, the brittle nature of glass has posed major manufacturing challenges, especially during TGV drilling and singulation — the process of precisely cutting large glass panels into smaller, individual substrates. Any micro-cracks or "SeWaRe defects" (where pieces lift or crack due to micro-fractures) can significantly lower production yields.

Breaking Through the Singulation Barrier

Philoptics has developed specialized laser singulation technology tailored for glass substrates, addressing the industry's long-standing pain points. The system cuts glass with minimal micro-cracking, reducing the risk of yield loss. This achievement builds on the company's prior success with TGV equipment, which creates the microscopic holes necessary for electrical conductivity in glass substrates.

According to Philoptics, it remains the only company to have successfully deployed both TGV and singulation equipment into mass production.

"We're expanding our lineup of core equipment for glass substrates while steadily building a proven track record of deliveries," a Philoptics representative stated. "We're committed to strengthening our technology and diversifying our customer base to maintain a competitive edge."

While details of the latest shipment — including the customer and deal size — remain confidential due to non-disclosure agreements, the company confirmed that the equipment has been delivered to a major global semiconductor manufacturer.

Market Potential on the Rise

Industry research firm Future Market Insights forecasts that the global glass substrate market will grow from $2.3 billion in 2024 to $4.2 billion by 2034, driven by next-generation semiconductor applications.

Philoptics' continued innovation and equipment diversification position it as a key player in the race to commercialize glass substrates — a material that could redefine semiconductor performance and efficiency in the coming decade.