On May 17th, Xiamen Bolion Tech. Co., Ltd. (referred to as Bolion Tech, NEEQ:838192)announced it had submitted a counseling filing application to the Xiamen Securities Regulatory Bureau for the public issuance of stocks to unspecified qualified investors and listing on the Beijing Stock Exchange.

▲Xiamen Bolion Tech. Co., Ltd.

Xiamen Bolion Tech. Co., Ltd. was established in Jan. 23, 2003 with 30,000 sq. m of clean plant area and the most advanced FPC manufacturing equipment and testing instruments. Our monthly capacity is 40,000sq. m of high-quality Single-sided, Double-sided, Dual-access, Multilayer, Air-gap FPCs, Rigid-Flex PCBs and assembly, which are widely used in the automotive, battery pack, medical devices, industrial control, aerospace, and consumer electronics industries.

Milestone

R&D Power

 Core technology 1———Super long and large FPC: Length up to 30m.  Unit Image 250*2000MM

 Core technology 2—–Complex and special FPC: Battery pack protection board, Multilayer with or without airgap FPC,  Up to 12 layer Rigid-Flex PCB.

 Core technology 3—FPC Patents: 77 totally.