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PCB equipment supplier Asia Neo Tech Announces Leadership Changes - PCB Manufacturing

On March 7, 2025, Asia Neo Tech Industrial Co., Ltd. (ANT) (4542.TWO), a leading PCB equipment supplier, held a board meeting to announce key leadership changes. Former General Manager Wu Mingzhi was appointed as Chairman, effective immediately. Outgoing Chairman Deng Quankai retired due to personal reasons and simultaneously resigned from the board. Additionally, Deputy General Manager Lin Fengzheng was promoted to General Manager, while Chen Huanwei took over as Manager of the Management Department.

These leadership changes come as ANT strengthens its presence in the advanced packaging market. In December 2024, Gudeng Precision announced a collaboration with Symtek, Machvision, and ANT to develop a comprehensive CoWoS advanced packaging solution, targeting growing market opportunities.

Gudeng’s integrated solution combines its advanced packaging carriers with Symtek’s automated storage systems, offering a full-series carrier solution for advanced packaging. In parallel, Gudeng partnered with Machvision to develop an AOI (Automated Optical Inspection) system, which uses advanced lighting configurations and computer algorithms to quickly identify defects and contaminants in semiconductor production lines. This system, combined with ANT’s carrier cleaning machines, forms a multifunctional cleaning and inspection solution for CoWoS packaging.

By working with Symtek, Machvision, and ANT, Gudeng aims to provide customers with a one-stop CoWoS advanced packaging solution, enhancing efficiency and quality control. Additionally, Gudeng’s next-generation High-NA EUV POD (Extreme Ultraviolet Photomask Carrier) has been certified by ASML and is currently being sampled by customers, reinforcing its position in the semiconductor supply chain.

Leading Manufacturer of PCB Wet Process Equipment TechWin

With ANT’s leadership restructuring and its role in a major industry collaboration, the company is positioning itself for continued growth and innovation in the rapidly evolving PCB and advanced packaging industries.

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