A subsidiary of the OKI Group, OKI Circuit Technology (OTC), has announced a breakthrough in multi-layer printed circuit board (PCB) technology, achieving a 55-fold improvement in heat dissipation compared to conventional PCBs. The innovation features stepped copper coin technology, available in circular and rectangular designs, tailored to the shapes of electronic components for optimal heat management.

Addressing Heat Challenges in Compact and Extreme Environments

As semiconductors grow more compact and powerful, efficient heat dissipation has become critical, especially in environments where traditional cooling methods like fans and heat sinks are unfeasible, such as outer space. The stepped copper coin improves heat conduction efficiency by increasing the heat-dissipating area, transferring thermal energy from PCB-mounted components to external casings or structures.

This innovation builds on OTC's 2015 copper coin insertion technology, which embedded cylindrical copper coins with high thermal conductivity into PCBs to manage heat in space-constrained applications. The newly developed stepped design doubles heat dissipation efficiency and offers customizable options for various component and substrate shapes, further optimizing thermal performance.

Expanding Aerospace Capabilities

With aerospace markets as a key focus, OKI provides end-to-end manufacturing services certified by JAXA (Japan Aerospace Exploration Agency), including PCB design, assembly, reliability testing, and failure analysis. The company plans to integrate the stepped copper coin technology into compact devices and aerospace applications, aiming to meet the stringent demands of the global aerospace market.

OTC President Masaya Suzuki emphasized the significance of this advancement: "Our stepped copper coin technology enables efficient thermal management in devices where traditional cooling is not an option, further solidifying our position in the aerospace and compact electronics markets."

OKI's commitment to innovation and quality positions it as a leader in PCB manufacturing, particularly in sectors requiring high reliability and precision. The company plans to expand its technology offerings to support global markets in space exploration, compact devices, and other advanced applications.