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New U.S.-Canada Partnership to Strengthen Advanced Packaging and Printed Circuit Board Manufacturing in North America

March 27, 2023 (PCB UNION) --U.S. President Biden and Canadian Prime Minister Justin Trudeau vowed to continue and strengthen their cooperation on trade, security and addressing climate change Friday(March 24, 2023) after a day of meetings, speeches and a joint press conference in Ottawa.


In his speech to Parliament, Mr. Biden underscored the lengthy and robust relationship between Canada and the United States.The leaders issued a joint statement documenting their commitment to embrace clean energy and create good jobs, strengthen semiconductor supply chains, protect their shared waters and the Arctic ecosystem, and bolster global alliances such as NATO, the United Nations and the G20.


They announced partnership between the United States and Canada ‘to strengthen advanced packaging for semiconductors and printed circuit boards in North America,’ including an additional USD $50 million in U.S. Defense Production Act funding for those purposes.


"In order to achieve their shared goals, the U.S. and Canada must invest in and support the growth of the electronics manufacturing ecosystem, including printed circuit boards (PCBs), IC substrates, and semiconductor assembly. Neglecting a “silicon-to-systems” approach would undercut the promise of the CHIPS Act and the region’s long-term leadership in innovation."


“Today’s announcement represents another meaningful step toward rebuilding a North American electronics manufacturing industry that was once the envy of the world.” John W. Mitchell, president and CEO of IPC, the global electronics manufacturing association, said.


Here are additional PCB UNION resources on this issue:


FACT SHEET: Strengthening the United States-Canada Partnership


● Reps. Anna Eshoo (D-CA) and Blake Moore (R-UT) recently called on the U.S. Department of Defense (DoD) to use the Defense Production Act (DPA) to increase domestic production of printed circuit boards (PCBs) and integrated circuit (IC) substrates. With over 50% of PCBs being imported from China, they said it is critical that the DoD increase domestic production and ensure the use of electronics from trusted sources. Read the full letter here.


● Mexican Economy Minister Raquel Buenrostro and U.S. Secretary of Commerce Gina Raimondo agreed to set out a plan by early 2023 for the relocation of companies from Asia to North America, in particular for printed circuit boards and semiconductors.twitter

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