MicroConnex fabricates a wide range of high-density, fine-pitch (1.1 mil trace/space), complex (multilayer with blind and buried vias) flexible circuits (FPC) and provides contract laser microvia-drilling and micromachining services. Using ESI 5330 and 5335 series laser systems along with IPG IX-6100s. The company machines various flexible and rigid materials, including alumina, kapton, and other exotic materials. MicroConnex also deposits (sputters) specialty thin-film materials.