The Micro Systems Technologies (MST) group is specialized in developing and manufacturing miniaturized, integrated electronic module solutions with highest reliability from one source.

Our offerings include:

• Highly complex HDI/microvia PCBs in flexible, rigid-flex and rigid technologies

• LCP and Chip-substrates solutions

• Ceramic substrates based on LTCC (Low Temperature Co-fired Ceramic) 

• Semiconductor packaging processes including production of Stacked Die BGAs using transfer molding

• Advanced assembly in the field of SMT and chip & wire

• High-performance batteries and battery packs for active implants
  

To assure reliability the MST companies have developed comprehensive and systematic methodologies that focus on the application of reliability technologies - from development and manufacture to monitoring.