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Merger of two subsidiaries of global PCB giant Unimicron delayed by one year

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Kunshan Dingxin Electronic Co., Ltd.

On July 26, Taiwanese PCB giant Unimicron (3037.TW) announced that the merger of its subsidiaries, Kunshan Dingxin Electronic Co., Ltd. and Kunshan Dingchangxin Electronic Technology Co., Ltd., has been rescheduled to January 1, 2025.

Initially, the merger was slated for January 1, 2024, later adjusted to October 1, 2024. This latest announcement further postpones the merger date to January 1, 2025.

About Kunshan Dingxin Electronic Co., Ltd.

Kunshan Dingxin Electronic Co., Ltd. was established in 1998 and is located at 168 Xiaolin Road, Kunshan, Jiangsu Province. Funded by Taiwan-based Unimicron Group, the company has a registered capital of USD 82 million and a total investment exceeding USD 200 million. The plant covers an area of approximately 100,000 square meters and currently employs over 4,800 people. The company specializes in manufacturing printed circuit boards (PCB) and high-density interconnect (HDI) boards, which are widely used in network communications, mobile phones, PDAs, and automotive industries. Its primary customers include several Fortune 500 companies.

About Kunshan Dingchangxin Electronic Technology Co., Ltd.

Kunshan Dingchangxin Electronic Technology Co., Ltd., established in 2019, is located in Kunshan, Suzhou, Jiangsu Province. It is a subsidiary of Taiwan-based Unimicron Group. The company is engaged in the research, development, processing, and manufacturing of new electronic components, including high-density interconnect (HDI) laminates, single-layer, double-layer, and multi-layer flexible boards, rigid-flex printed circuit boards, packaging substrates, and high-density, fine-line flexible circuit boards (with line width/spacing ≤0.05mm).

Editor:King&Lulu

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