-advertisement-

LX Semicon is focusing on glass substrates, dubbed the "dream substrate" in the semiconductor industry, as a new growth driver. The company is currently exploring a potential entry into this market and has been in talks with key partners.

Industry sources indicate LX Semicon is moving forward with plans to enter the glass substrate field. Currently, 2.5D packaging for AI semiconductors and HBM (High Bandwidth Memory) relies on interposers, which bridge the chip and PCB.

Traditional interposers were made primarily of silicon or organic materials. While silicon offers advantages, it's incredibly expensive. Organic interposers are cheaper but have limitations in heat resistance and surface roughness, making them unsuitable for fine circuits.

Glass interposers, on the other hand, offer a smooth surface for intricate circuits, superior high-temperature durability, and better power efficiency. They are also more cost-effective than silicon. This has led major semiconductor companies like Samsung Electronics, TSMC, and Intel to explore using glass substrates.

LX Semicon began exploring glass interposers earlier this year. It has been confirmed that the company has engaged with companies possessing core process technologies for glass interposer manufacturing, including TGV (Through Glass Via). TGV involves drilling microscopic holes into the glass substrate and plating them with copper, which is essential for establishing circuit connections between the chip and the interposer. If LX Semicon enters the glass substrate business, it could significantly reshape the company's operations.

LX Semicon is currently a fabless company specializing in display driver ICs (DDIs), timing controllers (T-Cons), and power management ICs (PMICs). DDIs for LG Display account for a significant portion of their revenue, reaching almost 90%. To address this concentrated business structure, LX Semicon has been actively pursuing new ventures, such as SiC (Silicon Carbide), a promising material for next-generation power semiconductors, and heat dissipation substrates.

For heat dissipation substrates, LX Semicon has completed a manufacturing facility specifically for the automotive market and is producing prototypes. However, commercialization of SiC has faced challenges until recently. This has led LX Semicon to seek new revenue streams, as industry insiders note.

Editor：Lulu

▼▼▼

Zhen Ding Technology and Eslite collaborate to build a new headquarters

Unitech PCB upbeat about LEO satellite demand

Ram Technology enters TGV etching solution market for glass substrates

Thailand's PCB industry set for explosive growth: Major companies accelerate expansion

All Flex Solutions completes installation of new inner layer factory

APCT launches as AdvancedPCB™, combines industry leaders under one brand