LQDX, a developer of high-performance materials and process IP for advanced semiconductor manufacturing, has entered into a multi-year sales and licensing agreement with Kansai Denshi Industries (KDI). This partnership will support the manufacturing of next-generation IC-substrates and advanced printed circuit boards.

Under the agreement, LQDX will provide its Liquid Metal Ink (LMIx®) chemistries and Aluminum Clad Laminate (ACL®) products through its partnership with Toyal-Alconix. Additionally, LQDX will offer a process license for Ultra High-Density Interconnect technology to meet the rising demand in the Japan-Asia market. This technology will enable Kansai Denshi, which currently produces 30-micron trace/space circuits, to advance to 5-micron trace/space products now and aims for 2-micron trace/space by 2025.

Simon McElrea, CEO of LQDX, expressed his satisfaction with the deal, emphasizing the importance of Japan as a global hub for the Heterogeneous Integration market. He highlighted LQDX's efforts in building a robust supply chain eco-system in the region with key partners and expressed anticipation for supporting the Asian market with advanced interconnect prototyping and manufacturing in the latter half of this year.

Zazunori Miyabe, Board Director of KDI, stated that Kansai Denshi Industries has always focused on leveraging the latest technologies to offer advanced circuit designs and manufacturing solutions. The inclusion of LQDX's LMIx® technology will enable them to deliver the most advanced IC-substrates and printed circuit boards for high-performance applications.