LECIP Group will start the construction of a new factory for printed circuit board assembly, investing approximately 1.1 billion yen in buildings and production facilities.

The new factory will be built adjacent to it's currently operational facility, with construction set to begin in March 2024, completion expected in October 2024, and operation scheduled to commence in January 2025.

LECIP Group has received inquiries from a wide range of industries, including consumer, automotive, and industrial equipment sectors, and has been involved in printed circuit board assembly and electronic device assembly. Recently, with the increase in electronic components due to the advancement of automotive electrification, as well as the rise in demand for lithium-ion batteries and semiconductors leading to increased equipment investment, inquiries have been on the rise. To meet the growing order volume, the construction of a new factory aims to expand the production area.

The new factory will establish a production line capable of manufacturing products primarily for automotive applications, from component acceptance to production, inspection, packaging, and shipping. With the expansion of the production area, Reship Electronics plans to target new customers in markets such as semiconductor manufacturing equipment and robotics, in addition to automotive products, to drive revenue growth.

New Factory Overview

Address: 1260-2 Kamibo, Honjo City, Gifu Prefecture (within the LECIP Group headquarters factory premises)

Investment Amount: Approximately 1.1 billion yen (Building: Approximately 750 million yen, Production Facilities: Approximately 350 million yen)

Site Area: 38,544.41 square meters

Building: 3-story steel structure, 3,380.28 cubic meters

Scheduled Start of Construction: March 2024

Scheduled Completion: October 2024

Planned Commencement of Operations: January 2025

Facilities: Printed Circuit Board Assembly Line and others

Factory Rendering

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