American company KLA Corporation (NASDAQ: KLAC) has launched the industry's most comprehensive range of process control and manufacturing solutions aimed at advancing IC substrate (ICS) production. These solutions are designed to meet the growing demand for high-performance chip packaging in cutting-edge applications. By enhancing interconnect density, yield, and profitability, KLA's offerings help manufacturers optimize production efficiency, enabling breakthroughs in the development of advanced semiconductor technologies.

As advanced packaging techniques increasingly adopt heterogeneous integration, which combines multiple semiconductor components to improve performance, reduce power consumption, and lower costs, IC substrates and panel interposers are gaining importance. These technologies connect chips to printed circuit boards (PCBs) more effectively, and KLA’s new solutions are positioned to optimize manufacturing processes to meet these evolving needs.

KLA’s latest portfolio includes direct imaging (DI), defect inspection, metrology, and chemical process control tools, all integrated with AI-driven smart solutions. These products are designed to improve yield, reduce delivery times, and enhance overall production efficiency, even as packaging sizes grow and new materials, such as glass substrates, are introduced.

Key products in the new lineup include the Corus™ direct imaging platform, optimized for next-generation IC substrates and high-density interconnects (HDI), and the Serena™ DI platform, designed to deliver high-quality, fine-line imaging for large, multilayer organic substrates. The Lumina™ platform offers advanced inspection and metrology for high-performance IC substrates and panel interposers, including those made from glass, providing high sensitivity detection and cost optimization.

These solutions are compatible with KLA’s existing process control tools, such as Orbotech Ultra PerFix™, EcoNet™, Zeta™-6xx, and ICOS™ T890, to maximize synergy in production workflows. Additionally, KLA’s Frontline software centralizes data from across the manufacturing process, enabling better yield management through AI-driven insights.

Oreste Donzella, KLA’s Executive Vice President and Chief Strategy Officer, stated, “With this portfolio, KLA reinforces its leadership in semiconductor ecosystem innovation. IC substrates and panel-level packaging technologies are critical for connecting high-performance chips of the future, and we are working closely with customers to solve complex production challenges and significantly improve their yield.”

KLA will showcase these new solutions at the TPCA Show in Taiwan from October 23 to 25.

About KLA

KLA Corporation develops industry-leading equipment and services that enable innovation throughout the electronics industry. We provide advanced process control and process-enabling solutions for manufacturing wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel displays. In close collaboration with leading customers across the globe, our expert teams of physicists, engineers, data scientists and problem-solvers design solutions that move the world forward.