South Korean company JNTC announced on the 29th that it has supplied 510x515mm glass substrate samples to three global semiconductor packaging companies. This new size is larger than the previously introduced 100x100mm glass substrate prototype released in June.

The company stated, "The newly developed glass through-via (TGV) substrate measures 510x515mm and incorporates advanced processing technologies, including via hole drilling, etching, plating, and polishing." They added, "For mass production of large-area glass substrates, it's crucial to quickly achieve optimal plating conditions for all via holes. We have differentiated our technology to ensure uniform plating across the entire substrate."

JNTC noted, "Due to confidentiality agreements (NDA) with our clients, we cannot disclose the names of the packaging companies receiving the samples at this time. However, we are negotiating product specifications and pricing with several other packaging firms." They also mentioned plans to prepare for mass production by utilizing the remaining space at their fourth factory in Vietnam, following the establishment of a demo line at Plant 3, with mass production expected to begin in the second half of next year.

JNTC aims to leverage its expertise in curved (3D) cover glass technology to expand into the TGV glass substrate market.

The company is targeting the glass interposer market, which involves replacing traditional silicon interposers with glass materials. Glass interposers can substitute silicon interposers in semiconductor substrates that currently use resin cores, and they are already being used in niche markets, including some medical devices, due to their superior chemical resistance compared to silicon.

CEO Jo Nam-hyuk expressed confidence, stating, "With the supply of our first samples to clients and secured funding for our primary mass production plant, we aim to grow into a true global glass materials company by 2025."