JNTC, a leading South Korean company in the 3D cover glass industry, has successfully developed a new semiconductor glass substrate, positioning itself for a significant growth opportunity. The Through Glass Via (TGV) glass substrate, often referred to as the "dream substrate," overcomes the limitations of traditional plastic-based substrates. It reduces semiconductor packaging thickness while improving power efficiency, marking an innovative breakthrough in the field of glass substrates for semiconductor applications.

In June last year, JNTC unveiled its first TGV glass substrate prototype for semiconductor packaging. By October, the company had completed the development of large-area TGV glass substrates, which are now being supplied as samples to three major global semiconductor packaging companies. Full-scale mass production is scheduled to commence later this year.

A company official stated on the 6th, "We plan to set up the first mass production line by the first half of this year, and we expect to begin generating revenue in the second half. Some of the samples have already been sold commercially, and by the second half, we expect significant quantities to be supplied to the market."

The TGV glass substrate offers notable features: it reduces the thickness of semiconductor packaging while being heat-resistant and highly efficient in terms of power. TGV technology creates microscopic electrode channels in the glass, enabling the creation of ultra-precise holes using laser TGV. This unique capability makes it an ideal choice for enhancing semiconductor performance and miniaturization, positioning it as a leading technology in next-generation semiconductor packaging.

Through the commercialization of TGV glass substrates, JNTC aims to diversify its product offerings and create synergies with its existing smartphone and automotive cover glass businesses. This strategy is expected to stabilize the company’s revenue structure and strengthen its position in the global market.