On March 6th, South Korean company JNTC (KOSDAQ: 204270) announced that it has started supplying samples of its large-area laser glass via (TGV) glass substrates to 11 companies within the global semiconductor glass substrate supply chain, including two U.S.-based firms, two in Europe, one in China, two domestic firms, and others in Japan.

JNTC possesses advanced technologies for processing glass substrates used in semiconductor packaging, including TGV and electrode plating.  The company stated, "The newly developed glass through-via (TGV) substrate incorporates advanced processing technologies, including via hole drilling, etching, plating, and polishing.  For mass production of large-area glass substrates, it's crucial to quickly achieve optimal plating conditions for all via holes.  We have differentiated our technology to ensure uniform plating across the entire substrate."

Notably, in June last year, JNTC unveiled its first TGV glass substrate prototype for semiconductor packaging. By October of the same year, the company had completed the development of large-area TGV glass substrates and began supplying samples to three major global semiconductor packaging companies. Full-scale mass production is scheduled to commence later this year.

With its cutting-edge TGV glass substrate technology, JNTC is poised to revolutionize the semiconductor packaging industry. By addressing key challenges such as power efficiency, thickness reduction, and heat resistance, the company is positioning itself as a leader in next-generation semiconductor materials. As JNTC expands its global supply chain and prepares for full-scale mass production, its strategic focus on innovation and diversification is expected to drive significant growth, solidifying its role as a key player in the global semiconductor market.