According to the latest statistics released by the Japan Electronics Packaging Circuits Association (JPCA), the production volume of printed circuit boards (PCBs) in Japan, including rigid PCBs, flexible PCBs, and module substrates, in June 2023 decreased by 16.5% from the same period last year to 843,000 square meters and has been declining for 17th consecutive months. The production value dropped sharply by 14.3% to JPY 50.794 billion, which has been declining for 8 consecutive months and the fourth consecutive month of double-digit (more than 10 percent) decline.

In terms of category, the production volume of printed circuit boards (PCBs) in Japan for June 2023 showed a decline in rigid PCBs, with production volume dropped by 16.5% to 679,000 square meters, marking the 16th consecutive month of decline, while the production value for rigid PCBs decreased by 17.6% to JPY 32.190 billion, which has been declining for the 10th consecutive month;The production volume of flexible PCBs dropped by 12.4% to 117,000 square meters, marking the second decline in three months, while the production value for flexible PCBs increased by 2.6% to JPY 2.689 billion, which has been growing for the first time in eight months; The production volume of module substrates dropped sharply by 25.4% to 46,000 square meters, marking the 13th consecutive month of decline, while the production value for module substrates decreased by 9.4% to JPY15.915 billion, which is the third time of decline in three months.

From January to June 2023,the production volume of PCBs in Japan decreased by 13.7% from the same period last year to 4.947 million square meters, and the production value decreased by 14.8% to JPY 291.388 billion.Among them, the production volume of rigid PCBs decreased by 13.0% to 4.038 million square meters, and the production value decreased by 19.0% to JPY 177.402 billion;The production volume of flexible PCBs decreased by 6.7% to 659,000 square meters, and the production value decreased by 8.2% to JPY 13.310 billion; The production volume of module substrates dropped sharply by 35.8% to 250,000 square meters, while the production value decreased by 7.2% to JPY 100.676 billion.

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