New Albany, Ohio – February 27, 2025 – Intel has announced a significant delay in the construction timeline for its $100 billion Ohio One semiconductor manufacturing site, pushing the completion of its first fabrication plant (fab) to 2030. The decision reflects the company's efforts to align investments with market demand and financial prudence, while maintaining flexibility to accelerate if needed.

Originally slated for completion in 2025, the Ohio One site, once dubbed the "Silicon Heartland," has faced multiple delays. The first phase (Mod 1) is now expected to begin production between 2030 and 2031, with the second phase (Mod 2) following in 2032. Intel emphasized that the revised timeline allows the company to manage capital expenditures more effectively during a period of uncertain demand and financial challenges.

The Ohio campus, spanning 1,000 acres, is designed to house up to eight fabs and support facilities. Intel initially planned to invest 28 billion in the first phase, with the total project estimatedat 100 billion. However, the company has slowed construction to avoid overextending its resources, particularly as its foundry business continues to face significant losses.

Despite the delay, construction progress continues. The underground foundation has been completed, and above-ground work is underway. Over 6.4 million labor hours have been invested, with key installations such as underground piping, concrete structures, and utility trenches already in place. Hiring and workforce training are also ongoing, with Ohio employees receiving training at Intel facilities in Arizona, New Mexico, and Oregon.

In a message to employees, Naga Chandrasekaran, Intel's Chief Global Operations Officer, stated, “We are taking a prudent approach to ensure we complete the project in a financially responsible manner that sets up Ohio One for success well into the future. We will continue construction at a slower pace, while maintaining the flexibility to accelerate work and the start of operations if customer demand warrants.”

The delay also aligns with Intel's broader strategy to focus on its 18A process node, set to debut later this year with the Panther Lake client processors. This advanced node is expected to attract external foundry customers, potentially boosting demand for Intel's manufacturing capabilities.

The Ohio project's revised timeline reflects Intel's cautious approach amid market volatility and financial pressures. However, the company remains committed to its long-term vision, ensuring that the Ohio One site will be equipped with cutting-edge technologies, including ASML's High-NA EUV tools, to meet future semiconductor demands.

As Intel navigates these challenges, the Ohio One site stands as a testament to the company's ambition to reclaim leadership in the semiconductor industry, even as it balances immediate financial realities with long-term strategic goals.