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Intel Achieves Breakthrough: First 18A Wafers Roll Off Arizona Production Lines Ahead of Schedule - IC Manufacturing

Intel's highly anticipated 18A process node has reached a major breakthrough, with the first wafers rolling off production lines ahead of schedule at the company's Arizona facility — marking a critical step in Intel's race to reclaim leadership in advanced semiconductor manufacturing.

Early Production and Strong Yields

On March 13, 2025, Intel engineering manager Pankaj Marria celebrated the achievement on LinkedIn, stating, “The Eagle has landed!” — confirming that Intel's team, known internally as the “Eagle Team,” successfully completed the first batch of 18A production. Marria emphasized that this is just the beginning for Intel's U.S.-developed and manufactured 2nm-class technology.

Originally slated for late 2025, Intel now appears on track to begin mass production by mid-year, accelerating its timeline. The company's Panther Lake processors, part of the Core Ultra 300 series, are expected to debut as the first commercial product using the new node in late 2025.

Intel's 18A node features:

● RibbonFET (GAA transistor architecture) for enhanced current control

● PowerVia backside power delivery to improve density and reduce power loss

● 15% performance boost and 30% higher density over Intel 3

● ISO power efficiency improved by 4%, with lower inherent resistance

According to TechInsights, Intel's 18A boasts a performance score of 2.53, edging out TSMC's N2 (2.27) and Samsung's SF2 (2.19) — positioning it as the highest-performing 2nm-class node on the market.

Pankaj Marria celebrated the achievement on LinkedIn, stating, “The Eagle has landed!”

Top Chipmakers Testing Intel's 18A

Intel's breakthrough comes as major industry players take notice. Reports from Reuters confirm that NVIDIA and Broadcom are actively conducting manufacturing tests on Intel's 18A wafers, while AMD is evaluating the node's performance for potential future production.

If these three semiconductor giants — all among the top five global chip designers — adopt Intel's process, it could signal a turning point for Intel Foundry Services (IFS), boosting its efforts to challenge TSMC and Samsung.

Leading Manufacturer of PCB Wet Process Equipment TechWin

Intel's Foundry Comeback Vision

The early success of 18A aligns with Intel's new CEO Lip-Bu Tan's ambitious push to revitalize the company's foundry business. In his recent letter to employees, Tan promised to “rebuild Intel into a world-class foundry”, accelerating the company's comeback as a leading chipmaker.

Intel has also confirmed that its Arizona Fab 52 and Fab 62 facilities will play a central role in manufacturing Panther Lake's compute chiplets on 18A — showcasing its strategy of combining leading-edge technology with U.S.-based manufacturing for added supply chain resilience.

With Intel now reportedly ahead of schedule and securing early interest from major customers, the 18A node could be the pivotal moment that reshapes the competitive landscape in advanced semiconductor manufacturing.

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