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Innotron Memory(合肥長鑫), the parent company of China's leading chipmaker Changxin Memory Technologies Inc (CXMT, 長鑫存儲)), is set to invest at least 17.1 billion yuan (US$2.4 billion) in an advanced packaging plant in Shanghai for AI memory production.

This month, Innotron signed a contract with the local government through its Shanghai subsidiary to secure land. The new facility is expected to begin production by mid-2026, as per documents on the Shanghai government website.

The project will focus on various packaging technologies, including through-silicon via (TSV), essential for creating high-bandwidth memory for AI applications. The facility aims to provide a packaging capacity of 30,000 units per month.

Earlier this year, Innotron secured 10.8 billion yuan from investors, including GigaDevice Semiconductor Inc (兆易創新), according to a March filing.

Innotron is crucial to China's bid to rival the US in AI, a field requiring advanced semiconductors. However, China's chipmaking has been hindered by US-led restrictions on access to advanced equipment dominated by American, Dutch, and Japanese suppliers.

The Biden administration has also banned Nvidia from selling its top-tier AI semiconductors to China, leading to increased reliance on alternatives from Huawei. It remains unclear who manufactures high-bandwidth memory for Huawei’s AI accelerators.

CXMT began developing chipmaking technologies eight years ago using patents from the now-defunct German firm Qimonda AG. It produces chips for various products, including computer servers and smart vehicles, and is also aiming to develop AI memory.

CXMT competes with US-based Micron Technology Inc and South Korea’s Samsung Electronics Co and SK Hynix Inc. The Innotron subsidiary is under US scrutiny, with potential sanctions being considered, according to Bloomberg News.

Editor：Lulu

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