South Korean technology company AP Solution, led by CEO Choi Ji-hoon, announced on the 12th that it has developed a copper diffusion prevention (Anti-Cu Migration) plating technology.

AP Solution, a joint venture between Acculaser (CEO Choi Ji-hoon) and Daichi Korea (CEO Yoon Tae-hyun), specializes in technology transfer for key semiconductor glass substrate processes, including plating.

The new technology is said to significantly reduce copper diffusion (Cu Migration), a serious issue in printed circuit boards (PCBs) and glass substrates. Copper diffusion typically occurs in areas such as via holes, epoxy coating interfaces, ABF buildup layer boundaries, and soldering sections of PCBs, leading to shorts and potential malfunctions or fires. This problem is particularly critical in the commercialization of high-performance glass substrates, such as those used in AI applications.

AP Solution, using Daichi Korea's heterogeneous bonding technology, has developed a glass substrate with a bonding strength of over 8N/cm, more than double the 4N/cm achieved by other glass substrate developers.

The company's plating mechanism applies a heterogeneous bonding agent to TGV-completed glass panels, followed by electroless nickel plating and electrolytic copper plating. The process fills via holes using a filler during electrolytic copper plating, eliminating voids and effectively preventing copper diffusion caused by moisture infiltration in high-temperature, high-current environments.

AP Solution plans to provide samples with this technology to domestic glass substrate developers in November. Once TGV technology testing with Japanese partners is complete, the company will also reveal cross-sections of the via holes. The samples will incorporate roughness and transparency, key factors in copper diffusion prevention, to deliver the ideal TGV hole design to customers.

AP Solution expects this development to significantly improve the durability and reliability of glass substrates, which are essential for high-performance electronic devices. The company also anticipates that this technology will play a vital role in expanding the use of glass substrates in advanced fields like AI.

About AP Solution 

AP Solution is a South Korean technology company specializing in advanced plating and bonding technologies for semiconductor and electronics manufacturing. Known for its innovation in glass substrates and copper diffusion prevention (Anti-Cu Migration) solutions, the company plays a critical role in improving the reliability and performance of high-tech devices, such as AI systems and automotive electronics. AP Solution is focused on developing next-generation technologies that address key industry challenges, including reducing copper migration in PCBs and enhancing bonding strength in glass substrates. With a strong emphasis on R&D and collaboration with industry leaders, AP Solution is positioned as an emerging player in the global semiconductor materials market.