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Semiconductor substrate inspection company Gigavis (420770.KQ) will supply the world's first 2/2μm inspection equipment for Flip-Chip Ball Grid Array (FC-BGA) substrates to Samsung Electro-Mechanics (SEMCO) (009150.KS), Korea’s leading semiconductor substrate manufacturer.

Gigavis' 2/2μm inspection equipment has passed final testing and will be installed on the production line at Samsung Electro-Mechanics' Sejong plant. The company received a Letter of Intent (LOI) from Samsung Electro-Mechanics, ahead of a formal purchase order, for urgent production of the equipment, which is set for installation by January.

An industry source commented, "This is the first time 2/2μm inspection equipment has been supplied globally, marking a significant milestone. It’s also rare for a large corporation to make an urgent production request from a smaller company."

Gigavis confirmed ongoing discussions with a major electronics firm but declined to disclose further details due to non-disclosure agreements.

Samsung Electro-Mechanics’ Sejong plant is the company's sole domestic site dedicated to semiconductor package substrates, focusing on mobile Flip-Chip (FC)-Chip Scale Package (CSP) production.

Gigavis, a global leader in semiconductor substrate inspection, developed the world’s first inspection equipment capable of 2/2μm Line and Space (L/S) measurements last year. L/S refers to the width and spacing of lines on a semiconductor substrate, a critical specification measured in micrometers (μm).

Demand for FC-BGA, a high-value semiconductor substrate, has surged due to the AI boom. FC-BGA substrates connect high-performance semiconductor chips to the main substrate, minimizing signal loss and enabling fast data transmission, leading to recent supply imbalances.

Gigavis is also in the final testing stages of its 2/2μm inspection equipment for Panel-Level Packaging (PLP) with a global semiconductor leader, Samsung Electronics. PLP is an advanced packaging technology that eliminates the need for a printed circuit board (PCB) to connect semiconductors to the final product.

Gigavis will also ship a demo version of its 2/2μm inspection equipment to Austria’s A Corporation R&D center next month.

Editor：Lulu

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