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FNS Electronics, a manufacturer of high-performance semiconductor glass substrates, has taken its first step into the global market with the export of its first mass-produced glass substrate. On July 16, the company held a ceremony commemorating the initial shipment and export at its headquarters in Songdo, Incheon. Attendees included CEOs Choi Byung-cheol and Shin Jae-ho, along with Absolics CEO Oh Jun-rok.

FNS Electronics held a ceremony to commemorate the first shipment and export of glass substrates at its headquarters located in Songdo, Incheon (from the left, F&S Electronics CEO Choi Byeong-cheol and Shin Jae-ho)

FNS Electronics will supply its glass substrates, manufactured using proprietary processes, to Absollix's factory in Covington, Georgia, USA. Absollix is a subsidiary of SKC specializing in high-performance computing semiconductor glass substrates, founded in 2021. This year, FNS Electronics successfully achieved mass production of semiconductor glass substrates incorporating both Through-Glass Via (TGV) and metalizing technologies, a world first.

Established in 2021, FNS Electronics has secured global competitiveness by establishing an R&D center in Gumi, North Gyeongsang Province. The company has built a large-scale production system by adding equipment and personnel to its mass production facility in Songdo, focused on improving yield rates. Recently, FNS Electronics has secured significant investments in recognition of its cutting-edge technology and production capabilities, with plans to expand its global market presence.

Currently, FNS Electronics is the sole company manufacturing glass substrates incorporating both TGV and metalizing processes. CEO Choi Byung-cheol stated, “Glass substrates represent an innovative technology that will reshape the semiconductor packaging landscape. Global semiconductor companies are currently evaluating their adoption. This first export signifies recognition of FNS Electronics' core process technology capabilities. We will strive to lead the global glass substrate market moving forward.”

Editor：Lulu

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